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MSP430F149IPM.B Datasheet(PDF) 60 Page - Texas Instruments |
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MSP430F149IPM.B Datasheet(HTML) 60 Page - Texas Instruments |
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60 / 88 page  Processor Family CC = Embedded RF Radio MSP = Mixed-Signal Processor XMS = Experimental Silicon PMS = Prototype Device MCU Platform 430 = MSP430 low-power microcontroller platform Device Type Memory Type C = ROM F = Flash FR = FRAM G = Flash or FRAM (Value Line) L = No Nonvolatile Memory Specialized Application AFE = Analog Front End BQ = Contactless Power CG = ROM Medical FE = Flash Energy Meter FG = Flash Medical FW = Flash Electronic Flow Meter Series 1 = Up to 8 MHz 2 = Up to 16 MHz 3 = Legacy 4 = Up to 16 MHz with LCD 5 = Up to 25 MHz 6 = Up to 25 MHz with LCD 0 = Low-Voltage Series Feature Set Various levels of integration within a series Optional: A = Revision N/A Optional: Temperature Range S = 0°C to 50 C C to 70 C I = 40 C to 85 C T = –40 C to 105 C ° C = 0° ° – ° ° ° ° Packaging http://www.ti.com/packaging Optional: Tape and Reel T = Small reel R = Large reel No markings = Tube or tray Optional: Additional Features -EP = Enhanced Product ( 40°C to 105°C) -HT = Extreme Temperature Parts ( 55°C to 150°C) -Q1 = Automotive Q100 Qualified – – MSP 430 F 5 438 A I ZQW T -EP Processor Family Series Optional: Temperature Range MCU Platform Packaging Device Type Optional: A = Revision Optional: Tape and Reel Feature Set Optional: Additional Features 60 MSP430F149, MSP430F148, MSP430F147 MSP430F1491, MSP430F1481, MSP430F1471 MSP430F135, MSP430F133 SLAS272H – JULY 2000 – REVISED MAY 2018 www.ti.com Submit Documentation Feedback Product Folder Links: MSP430F149 MSP430F148 MSP430F147 MSP430F1491 MSP430F1481 MSP430F1471 MSP430F135 MSP430F133 Device and Documentation Support Copyright © 2000–2018, Texas Instruments Incorporated NOTE: This figure does not represent a complete list of the available features and options, and it does not indicate that all of these features and options are available for a given device or family. Figure 7-1. Device Nomenclature – Part Number Decoder |
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