| Electronic Components Datasheet Search |
|
DIO6010CST5 Datasheet(PDF) 7 Page - DIOO MICROCIRCUITS CO., LTD |
|
|
|||||||||||||||||||||||||||||
DIO6010CST5 Datasheet(HTML) 7 Page - DIOO MICROCIRCUITS CO., LTD |
|
7 / 12 page ![]() DIO6010 www.dioo.com © 2021 DIOO MICROCIRCUITS CO., LTD DIO6010• Rev. 1.6 Enable Operation Pulling the EN pin low (<0.4V) will shut down the device. During shut down mode, the DIO6010 shutdown current drops to lower than 0.1µA. Driving the EN pin high (>1.5V) will turn on the IC again. Load Transient Considerations: The DIO6010 regulator IC integrates the compensation components to achieve good stability and fast transient responses. In some applications, adding a 22pF ceramic cap in parallel with R1 may further speed up the load transient responses and is thus recommended for applications with large load transient step requirements. Layout Design: The layout design of DIO6010 regulator is relatively simple. For the best efficiency and minimum noise problems, we should place the following components close to the IC: CIN, L, R1 and R2. 1) It is desirable to maximize the PCB copper area connecting to GND pin to achieve the best thermal and noise performance. If the board space allowed, a ground plane is highly desirable. 2) CIN must be close to Pins IN and GND. The loop area formed by CIN and GND must be minimized. 3) The PCB copper area associated with LX pin must be minimized to avoid the potential noise problem. 4) The components R1 and R2, and the trace connecting to the FB pin must NOT be adjacent to the LX net on the PCB layout to avoid the noise problem. 5) If the system chip interfacing with the EN pin has a high impedance state at shutdown mode and the IN pin is connected directly to a power source such as a Li-Ion battery, it is desirable to add a pull down 1MΩ resistor between the EN and GND pins to prevent the noise from falsely turning on the regulator at shutdown mode. Output voltage ripple test A proper output ripple measurement should be done according to Figure 5 setup. Output voltage ripple should be measured across the output ceramic cap near the IC. 1. Remove the ground clip and head of the probe. Wind thin wires around the ground ring of the probe. Solder the end of the ground ring wire to the negative node of the COUT. Touch the probe tip to the positive node of the COUT.(Refer to Figure.5). 2. Minimize the loop formed by COUT terminals, probe tip and ground ring. 3. Change the probing direction to decouple the electromagnetic noise generated from the nearby buck inductor. (Refer to Figure.5) |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |