AS7262 datasheet(39/48 Pages) AMSOSRAM

Part #	AS7262

Description	6-Channel Visible Spectral_ID Device with Electronic Shutter and Smart Interface

PDF	48 Pages

Scroll/Zoom	100%

Manufacturer	AMSOSRAM [ams-OSRAM AG]

Direct Link	https://ams-osram.com/

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39 / 48 page

Page 38

Datasheet, Public

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[v4-00] 2022-Nov-30

AS7262 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 37:

Solder Reflow Profile

Figure 38:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5

°C/s

Soak time

tSOAK

2 to 3 minutes

Time above 217

°C(T

1)t1

Max 60s

Time above 230

°C(T

2)t2

Max 50s

Time above Tpeak - 10°C(T3)t3

Max 10s

Peak temperature in reflow

Tpeak

260

°C

Temperature gradient in cooling

Max -5

°C/s

Soldering & Storage

Information

AS7262 Datasheet(PDF) 39 Page - ams-OSRAM AG

AS7262 Datasheet(HTML) 39 Page - ams-OSRAM AG

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