R7F100GAF2DSP datasheet(4/183 Pages) RENESAS

4 / 183 page

RL78/G23

1. Outline

R01DS0395EJ0140 Rev.1.40

Page 4 of 177

Oct 31, 2025

1.2

List of Part Numbers

Figure 1 - 1

Part Number, Memory Size, and Package of RL78/G23

R 7 F 1 0 0 G L J 3 x x x C F B # AA0

RL78/G23

Renesas MCU

Renesas semiconductor product

Packaging specification

#AA0, #BA0, #UA0: Tray (LFQFP, LQFP, LSSOP, HWQFN)

#AC0, #BC0, #UC0: Tray (WFLGA)

#HA0: Embossed tape (LFQFP, LQFP, LSSOP, HWQFN)

#HC0: Embossed tape (WFLGA)

ROM number (omitted with blank products)

Product name

Ordering part number

Package type

SP: LSSOP, 0.65-mm pitch

FP: LQFP, 0.80-mm pitch

FA: LQFP, 0.65-mm pitch

FB: LFQFP, 0.50-mm pitch

NP: HWQFN, 0.50-mm pitch

LA: WFLGA, 0.50-mm pitch

Fields of application

C: Industrial applications

D: Consumer applications

Ambient operating temperature range

2: -40 to +85°C

3: -40 to +105°C

ROM capacity

F: 96 KB

G: 128 KB

H: 192 KB

J: 256 KB

K: 384 KB

L: 512 KB

N: 768 KB

Pin count

A: 30 pins

B: 32 pins

C: 36 pins

E: 40 pins

F: 44 pins

G: 48 pins

J: 52 pins

L: 64 pins

M: 80 pins

P: 100 pins

S: 128 pins

F: Flash memory

Device type

R7F100GAF2DSP Datasheet(PDF) 4 Page - Renesas Technology Corp

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