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LA-W5AM Datasheet(PDF) 13 Page - ams-OSRAM AG |
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LA-W5AM Datasheet(HTML) 13 Page - ams-OSRAM AG |
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13 / 23 page  Version 1.2 LA W5AM Recommended Solder Pad 6) page 23 Reflow soldering Empfohlenes Lötpaddesign 6) Seite 23 Reflow-Löten Solder resist Bare Copper Freies Kupfer Lötpasten Schablone Solder paste stencil Lötstopplack OHPY3637 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) 1 (0.039) Attention: Anode and Heatsink are electrically connected Achtung: Anode und Heatsink sind elektrisch verbunden 2015-12-16 13 |
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