ISO6042HDFPR datasheet(11/56 Pages) TI2

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6.7 Safety-Related Certifications

VDE

CQC

TUV

Plan to certify according to DIN

EN IEC 60747-17 (VDE 0884-17)

Plan to certify according to UL

1577 and CSA CAS Notice No.

Plan to certify according to

GB4943.1

Plan to certify according to EN

61010-1 and EN 62368-1

Certificate planned

6.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

DW-16 (Wide-SOIC) Package

Safety input, output, or supply current

RθJA = 71.8°C/W, VI = 5.5V, TJ = 150°C,

TA = 25°C

316.5

RθJA = 71.8°C/W, VI = 3.6V, TJ = 150°C,

TA = 25°C

483.6

RθJA = 71.8°C/W, VI = 2.75V, TJ = 150°C,

TA = 25°C

633.1

RθJA = 71.8°C/W, VI = 1.89V, TJ = 150°C,

TA = 25°C

921.1

Safety input, output, or total power

RθJA = 71.8°C/W, TJ = 150°C, TA = 25°C

1740.9

Maximum safety temperature

150

°C

DFP-16 (Wide-SSOP) Package

Safety input, output, or supply current

RθJA = 97.2°C/W, VI = 5.5V, TJ = 150°C,

TA = 25°C

233.8

RθJA = 97.2°C/W, VI = 3.6V, TJ = 150°C,

TA = 25°C

357.2

RθJA = 97.2°C/W, VI = 2.75V, TJ = 150°C,

TA = 25°C

467.6

RθJA = 97.2°C/W, VI = 1.89V, TJ = 150°C,

TA = 25°C

680.4

Safety input, output, or total power

RθJA = 97.2°C/W, TJ = 150°C, TA = 25°C

1286.0

Maximum safety temperature

150

°C

DBQ-16 (SSOP) Package

Safety input, output, or supply current

RθJA = 91.8°C/W, VI = 5.5V, TJ = 150°C,

TA = 25°C

247.6

RθJA = 91.8°C/W, VI = 3.6V, TJ = 150°C,

TA = 25°C

378.2

RθJA = 91.8°C/W, VI = 2.75V, TJ = 150°C,

TA = 25°C

495.1

RθJA = 91.8°C/W, VI = 1.89V, TJ = 150°C,

TA = 25°C

720.5

Safety input, output, or total power

RθJA = 91.8°C/W, TJ = 150°C, TA = 25°C

1361.7

Maximum safety temperature

150

°C

(1)

The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The

IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be

exceeded. These limits vary with the ambient temperature, TA.

The junction-to-air thermal resistance, RθJA, in the table is that of a device installed on a high-K test board for leaded surface-mount

packages. Use these equations to calculate the value for each parameter:

TJ = TA + RθJA × P, where P is the power dissipated in the device.

TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI, where VI is the maximum input voltage.

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ISO6040, ISO6041, ISO6042

SLLSFV3B – DECEMBER 2025 – REVISED AUGUST 2026

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