74LVC1G34

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© NXP Semiconductors N.V. 2016. All rights reserved.

Product data sheet

Rev. 6 — 5 December 2016

2 of 19

NXP Semiconductors

74LVC1G34

Single buffer

3. Ordering information

4. Marking

[1]

The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5. Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74LVC1G34GW

40 Cto +125 C

TSSOP5

plastic thin shrink small outline package; 5 leads;

body width 1.25 mm

SOT353-1

74LVC1G34GV

40 Cto +125 C

SC-74A

plastic surface-mounted package; 5 leads

SOT753

74LVC1G34GM

40 Cto +125 C

XSON6

plastic extremely thin small outline package; no leads;

6 terminals; body 1

 1.45  0.5 mm

SOT886

74LVC1G34GF

40 C to +125 C

XSON6

plastic extremely thin small outline package; no leads;

6 terminals; body 1

 1  0.5 mm

SOT891

74LVC1G34GN

40 C to +125 C

XSON6

extremely thin small outline package; no leads;

6 terminals; body 0.9

 1.0  0.35 mm

SOT1115

74LVC1G34GS

40 C to +125 C

XSON6

extremely thin small outline package; no leads;

6 terminals; body 1.0

 1.0  0.35 mm

SOT1202

74LVC1G34GX

40 C to +125 C

X2SON5

X2SON5: plastic thermal enhanced extremely thin

small outline package; no leads; 5 terminals;

body 0.8

 0.8  0.35 mm

SOT1226

Table 2.

Marking

Type number

Marking code[1]

74LVC1G34GW

YN

74LVC1G34GV

YN

74LVC1G34GM

YN

74LVC1G34GF

YN

74LVC1G34GN

YN

74LVC1G34GS

YN

74LVC1G34GX

YN

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

Fig 3.

Logic diagram