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74LVC74APW Datasheet(PDF) 3 Page - Nexperia B.V. All rights reserved |
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74LVC74APW Datasheet(HTML) 3 Page - Nexperia B.V. All rights reserved |
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3 / 19 page ![]() 74LVC74A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 7 — 20 November 2012 3 of 19 NXP Semiconductors 74LVC74A Dual D-type flip-flop with set and reset; positive-edge trigger 5. Pinning information 5.1 Pinning Fig 4. Logic diagram for one flip-flop mna421 SD CP RD D C C Q C C C C C C Q C C (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 5. Pin configuration for SO14 and (T)SSOP14 Fig 6. Pin configuration for DHVQFN14 74 1RD VCC 1D 2RD 1CP 2D 1SD 2CP 1Q 2SD 1Q 2Q GND 2Q 001aad106 1 2 3 4 5 6 7 8 10 9 12 11 14 13 001aad107 74 Transparent top view 1Q 2Q 1Q 2SD 1SD 2CP 1CP 2D 2RD 1D GND(1) 6 9 5 10 4 11 3 12 2 13 terminal 1 index area |
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