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MAS9180 Datasheet(PDF) 12 Page - Micro Analog systems |
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MAS9180 Datasheet(HTML) 12 Page - Micro Analog systems |
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12 / 15 page ![]() 12 (15) DA9180.004 15 September, 2005 SOLDERING INFORMATION N For Eutectic Sn/Pb TSSOP-16 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220 °C Maximum Temperature 240 °C Maximum Number of Reflow Cycles 2 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% N For Pb-Free, RoHS Compliant TSSOP-16 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260 °C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin |
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