Package information

EMIF01-SMIC01F2

4/7

3

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 7.

Flip Chip dimensions

Figure 8.

Flip Chip footprint

Figure 9.

Marking

1.42 mm ± 50 µm

310 µm ± 50

500 µm ± 50

210 µm

650 µm ± 65

Copper pad Diameter:

250 µm recommended, 300 µm max.

Solder stencil opening:

330 µm recommended

Solder mask opening recommendation:

340 µm min. for 300 µm copper pad diameter

E

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)