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Nichia

STSE-CY2095B

<Cat.No.031219>

7.CAUTIONS

(1) Lead Forming

· When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

Do not use the base of the leadframe as a fulcrum during lead forming.

· Lead forming should be done before soldering.

· Do not apply any bending stress to the base of the lead.

The stress to the base may damage the LED’s

characteristics or it may break the LEDs.

· When mounting the LEDs onto a printed circuit board, the holes on the circuit board should be

exactly aligned with the leads of the LEDs.

If the LEDs are mounted with stress at the leads,

it causes deterioration of the epoxy resin and this will degrade the LEDs.

(2) Storage

· The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Nichia and

the storage life limits are 3 months.

If the LEDs are stored for 3 months or more, they can be

stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.

· Nichia LED leadframes are comprised of a silver plated copper alloy.

The silver surface

may be affected by environments which contain corrosive gases and so on. Please avoid conditions

which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause

difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible.

· Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where

condensation can occur.