-4-

Nichia

STSE-CM6042A-1

<Cat.No.061208>

7.CAUTIONS

(1) Moisture Proof Package

· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.

There is a possibility that this can cause exfoliation of the contacts and damage to the optical

characteristics of the LEDs.

For this reason, the moisture proof package is used to keep moisture

to a minimum in the package.

· The moisture proof package is made of an aluminum moisture proof bag.

A package of

a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.

The silica gel changes its color from blue to pink as it absorbs moisture.

(2) Storage

· Storage Conditions

Before opening the package :

The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a

year.

When storing the LEDs, moisture proof packaging with absorbent material (silica gel)

is recommended.

After opening the package :

The LEDs should be kept at 30°C or less and 70%RH or less.

The LEDs should be soldered

within 168 hours (7days) after opening the package.

If unused LEDs remain, they should be

stored in moisture proof packages, such as sealed containers with packages of moisture absorbent

material (silica gel).

It is also recommended to return the LEDs to the original moisture proof bag

and to reseal the moisture proof bag again.

· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage

time, baking treatment should be performed using the following conditions.

Baking treatment : more than 24 hours at 65 ± 5°C

· Nichia LED electrodes are silver plated copper alloy.

The silver surface may be affected by

environments which contain corrosive substances. Please avoid conditions which may cause the LED

to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering

operations. It is recommended that the User use the LEDs as soon as possible.

· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where

condensation can occur.

(3) Heat Generation

· Thermal design of the end product is of paramount importance.

Please consider the heat generation

of the LED when making the system design.

The coefficient of temperature increase per input

electric power is affected by the thermal resistance of the circuit board and density of LED placement

on the board, as well as other components. It is necessary to avoid intense heat generation and operate

within the maximum ratings given in this specification.

· During operation of the LEDs the total power dissipation of the diode elements (red, green, and blue)

within the LEDs must not exceed the maximum power dissipation.

· The operating current should be decided after considering the ambient maximum temperature of LEDs.