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ESDA14V2-4BF2 Datasheet(PDF) 6 Page - STMicroelectronics |
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ESDA14V2-4BF2 Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() Package information ESDA14V2-4BF2 6/8 Figure 16. Flip Chip tape and reel specification Figure 14. Foot print recommendations Figure 15. Marking Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter x y x w z w Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location E Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 ± 0.1 4 ± 0.1 Ø 1.5 ± 0.1 0.73 ± 0.05 1.22 |
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