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ESDA8V2-1MX2 Datasheet(PDF) 5 Page - STMicroelectronics |
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ESDA8V2-1MX2 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 10 page ![]() ESDA8V2-1MX2 Package information 5/10 3 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Table 4. µQFN 2L dimensions Ref Dimensions Millimetres Inches Min Typ Max Min Typ Max A 0.51 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b1 0.25 0.30 0.35 0.010 0.012 0.014 D 1.45 0.057 E 1.00 0.039 e 0.95 1.00 1.05 0.037 0.039 0.041 L1 0.75 0.80 0.85 0.030 0.031 0.033 Figure 10. Footprint (dimensions in mm) Figure 11. Marking |
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