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EMIF10-LCD03F3 Datasheet(PDF) 1 Page - STMicroelectronics |
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EMIF10-LCD03F3 Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 7 page ![]() April 2008 Rev 1 1/7 7 EMIF10-LCD03F3 10-line IPAD™, EMI filter and ESD protection Features ■ High attenuation in the mobile frequency range (typically better than -40 dB from 900 MHz to 2GHz) ■ Very low clamping voltage ■ Low line capacitance (30 pF max) suitable for high-speed interfaces ■ Maximum rise and fall time: 6 ns (10% - 90%) ■ Compliant with high speed data rate ■ Lead-free Flip Chip package in 400 µm pitch ■ Very thin package: 0.6mm thickness Benefits ■ High efficiency in EMI filtering ■ High bandwidth: typically 200 MHz at -3 dB ■ 80% space saving versus discrete solution (BOM reduction) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Complies with the following standards ■ IEC61000-4-2 level 4 on inputs and outputs – ±15 kV (air discharge) – ± 8 kV (contact discharge) Applications Displays and cameras where outstanding EMI filtering in ESD sensitive equipment is required: ■ Mobile phones and PDAs ■ Personal and home entertainment (portable audio, DVD players, LCD TVs) ■ Portable navigation devices ■ Digital still cameras ■ Portable gaming systems Description The EMIF10-LCD03F3 is a 10-line highly integrated LC filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip Chip packaging means the package size is equal to the die size. This LC filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up ±15 kV. Figure 1. Pin layout (bump side) Figure 2. Device configuration TM: IPAD is a trademark of STMicroelectronics. Flip Chip (24 bumps) A B C D E 1 2 3 4 5 O10 I10 O2 O4 O6 O8 I1 I3 I5 I7 I9 GND GND GND O1 O3 O5 O7 O9 I2 I4 I6 I8 GND Input GND GND GND Output Low-pass Filter Ri/o = 125 ±20% Cline = 30 pF max Ω 0 0 0 0 www.st.com |
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