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STLM75DS2F Datasheet(PDF) 28 Page - STMicroelectronics |
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STLM75DS2F Datasheet(HTML) 28 Page - STMicroelectronics |
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28 / 37 page  Maximum ratings STLM75 28/37 5 Maximum ratings Stressing the device above the ratings listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 10. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature (VCC Off, VBAT Off) –60 to 150 °C TSLD (1) 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150 seconds). Lead solder temperature for 10 seconds 260 °C VIO Input or output voltage VCC +0.5 V VDD Supply voltage 7.0 V VOUT Output voltage VDD + 0.5 V IO Output current 10 mA PD Power dissipation 320 mW |
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