Revision history

FLI8638

6/7

4

Revision history

In order to meet environmental requirements, ST offers this device in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Table 2.

Document revision history

Date

Revision

Changes

08-Sep-2008

1

Initial release.