STPC4EDBI datasheet(60/93 Pages) STMICROELECTRONICS

Part #	STPC4EDBI

Description	X86 Core PC Compatible Information Appliance System-on-Chip

PDF	93 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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60 / 93 page

MECHANICAL DATA

60/93

Release 1.5 - January 29, 2002

5.2. 388-PIN PACKAGE THERMAL DATA

The

388-pin

PBGA package has a Power

Dissipation Capability of 4.5W. This increases to

6W when used with a Heatsink.

The structure in shown in Figure 5-4.

Thermal dissipation options are illustrated in

Figure 5-5 and Figure 5-6.

Figure 5-4. 388-Pin PBGA structure

Thermal balls

Power & Ground layers

Signal layers

Figure 5-5. Thermal Dissipation Without Heatsink

Ambient

Board

Case

Junction

Board

Ambient

Case

Junction

Board

Rca

Rjc

Rjb

Rba

125

8.5

Rja = 13 °C/W

Airflow = 0

Board dimensions:

The PBGA is centred on board

Copper thickness:

- 17µm for internal layers

- 34µm for external layers

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

There are no other devices

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Board temperature taken at the centrecentre ba

STPC4EDBI Datasheet(PDF) 60 Page - STMicroelectronics

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