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33982 Datasheet(PDF) 28 Page - Freescale Semiconductor, Inc |
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33982 Datasheet(HTML) 28 Page - Freescale Semiconductor, Inc |
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28 / 35 page ![]() Analog Integrated Circuit Device Data 28 Freescale Semiconductor 33982 PACKAGING SOLDERING INFORMATION PACKAGING SOLDERING INFORMATION SOLDERING INFORMATION The 33982B is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 33982B was qualified in accordance with JEDEC standards JESD22-A113-B and J-STD-020A. The recommended reflow conditions are as follows: • Convection: 225°C +5.0/-0°C • Vapor Phase Reflow (VPR): 215°C to 219°C • Infrared (IR)/Convection: 225°C +5.0/-0°C The maximum peak temperature during the soldering process should not exceed 230°C. The time at maximum temperature should range from 10s to 40s maximum. |
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