MP3V5050

Sensors

4

Freescale Semiconductor

Figure 3 illustrates the Differential/Gauge Sensing Chip in

the basic chip carrier (Case 482). A fluorosilicone gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MP3V5050 series pressure sensor operating

characteristics, and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media,

other than dry air, may have adverse effects on sensor

performance and long-term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 2 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0° to 85°C using the decoupling circuit shown in Figure 4. The

output will saturate outside of the specified pressure range.

Figure 4 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 2. Output versus Pressure Differential

Figure 3. Cross-Sectional Diagram SOP

(not to scale)

Figure 4. Recommended Power Supply Decoupling

and Output Filtering

(For additional output filtering, please refer to

Application Note AN1646.)

Differential Pressure (kPa)

3

2

1

0

0

5

10

15

20

25

30

35

40

45

55

50

Transfer Function:

TEMP = 0 to 85°C

TYPICAL

MIN

MAX

3 V

1.0

µF

0.01

µF

470 pF

GND

IPS

OUTPUT

FLUOROSILICONE

GEL DIE COAT

WIRE BOND

DIFFERENTIAL

SENSING ELEMENT

THERMOPLASTIC

CASE

STAINLESS

STEEL CAP

LEAD

FRAME

P1

P2

DIE BOND

DIE