12

5

10

10

100

300

tp(ms)

ITSM(A),I²t(A²s)

Tj initial=25°C

ITSM

I²t

Fig. 7: Non repetitive surge peak on-state current

for a sinusoidal pulse with width tp<10ms, and cor-

responding value of I

0

4

8

12162024

2832

3640

0

10

20

30

40

50

60

70

80

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 9: Thermal resistance junction to ambient ver-

sus copper surface under tab (Epoxy printed circuit

board FR4, copper thickness: 35

µm).

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

1

10

100

I (A)

TM

Tj=25°C

Tj max.:

Vto=0.83V

Rt=56 m

Ω

Tj=Tj max.

V (V)

TM

Fig. 8: On-state characteristics (maximum values).

0

40

80

120

160

200

240

280

320 360

T (°C)

250

200

150

100

50

0

Epoxy FR4

board

Metal-backed

board

245°C

215°C

t (s)

Fig. 10: Typical reflow soldering heat profile, either

for mounting on FR4 or metal-backed boards.

T835-600G / T850-600G

4/5