New Product

SS3P3L & SS3P4L

Vishay General Semiconductor

www.vishay.com

For technical questions within your region, please contact one of the following:

PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com

Document Number: 88986

Revision: 30-Jul-08

4

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Conform to JEDEC TO-277A

0.016 (0.40)

0.006 (0.15)

0.047 (1.20)

0.039 (1.00)

0.187 (4.75)

0.175 (4.45)

0.262 (6.65)

0.250 (6.35)

0.242 (6.15)

0.238 (6.05)

0.171 (4.35)

0.167 (4.25)

K

21

0.026 (0.65) NOM.

TO-277A (SMPC)

0.146 (3.70)

0.134 (3.40)

0.087 (2.20)

0.075 (1.90)

0.189 (4.80)

0.173 (4.40)

0.049 (1.24)

0.037 (0.94)

0.053 (1.35)

0.041 (1.05)

0.030 (0.75) NOM.

0.084 (2.13) NOM.

0.155 (3.94)

NOM.

Mounting Pad Layout

0.268

(6.80)

0.186

(4.72)

MIN.

0.050

(1.27)

MIN.

0.041

(1.04)

0.055

(1.40)

MIN.

0.189

(4.80)

MIN.