SSL1623PH_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 15 September 2008

12 of 15

NXP Semiconductors

SSL1623PH

13. Package outline

Fig 6.

Package outline DIP16

UNIT

A

max.

1

2

cE

e

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

99-12-27

03-02-13

A

min.

A

max.

b

max.

w

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.254

2.54

7.62

0.3

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7

0.51

3.7

0.15

0.021

0.015

0.013

0.009

0.01

0.1

0.02

0.19

050G09

MO-001

SC-503-16

c

(e )

1

A

L

e

D

Z

16

1

9

8

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1)

(1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1