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USBDFXXW5 Datasheet(PDF) 2 Page - STMicroelectronics |
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USBDFXXW5 Datasheet(HTML) 2 Page - STMicroelectronics |
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2 / 9 page ![]() USBDFxxW5 2/9 IEC-61000-4-2, level 4 ±15 kV (air discharge) ±8 kV (contact discharge) MIL STD 883C, Method 3015-6 Class 3 C = 100 pF R = 1500 Ω 3 positive strikes and 3 negative strikes (F=1Hz) COMPLIES WITH THE FOLLOWING ESD STANDARDS: Symbol Parameter Value Unit VPP ESD discharge IEC 61000-4-2, contact discharge ESD discharge - MIL STD 883 - Method 3015-6 ±15 ±25 kV kV Tj Junction temperature 150 °C Tstg Storage temperature range - 55 to +150 °C TL Lead solder temperature (10 second duration) 260 °C Top Operating temperature Range 0to70 °C Pr Power rating per resistor 100 mW ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Symbol Parameters Test conditions Min Typ Max Unit VBR Diode breakdown voltage IR = 1mA 6V VF Diode forward voltage drop IF = 50mA 0.9 V ELECTRICAL CHARACTERISTICS (Tamb = 25°C) |
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