08055C103MAT2A datasheet(16/18 Pages) AVX

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Surface Mounting Guide

MLC Chip Capacitors

APPLICATION NOTES

Storage

Good solderability is maintained for at least twelve months,

provided the components are stored in their “as received”

packaging at less than 40°C and 70% RH.

Solderability

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Recommended Soldering Profiles

Lead-Free Reflow Profile

Lead-Free Wave Soldering

The recommended peak temperature for lead-free wave

soldering is 250°C-260°C for 3-5 seconds. The other para-

meters of the profile remains the same as above.

The following should be noted by customers changing from

lead based systems to the new lead free pastes.

a) The visual standards used for evaluation of solder joints

will need to be modified as lead free joints are not as

bright as with tin-lead pastes and the fillet may not be as

large.

b) Resin color may darken slightly due to the increase in

temperature required for the new pastes.

c) Lead-free solder pastes do not allow the same self align-

ment as lead containing systems. Standard mounting

pads are acceptable, but machine set up may need to be

modified.

General

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

Handling

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4°C/second

Termination Type

Solder

Immersion Time

Tin/Lead/Silver Temp. °C

Seconds

Nickel Barrier

60/40/0

260 ± 5

30 ± 1

Reflow

300

250

200

150

100

10 sec. max

1min

(Minimize soldering time)

Natural

Cooling

220

°C

250

°C

Preheat

Wave

300

250

200

150

100

(Preheat chips before soldering)

T/maximum 150

°C

3 sec. max

1 to 2 min

Preheat

Natural

Cooling

230

°C

250

°C

300

250

200

150

100

150

200

250

300

• Pre-heating: 150

°C ±15°C / 60-90s

• Max. Peak Gradient 2.5

°C/s

• Peak Temperature: 245

°C ±5°C

• Time at >230

°C: 40s Max.

Time (s)

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