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THBTGFR5210-CE Datasheet(PDF) 6 Page - Seoul Semiconductor |
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THBTGFR5210-CE Datasheet(HTML) 6 Page - Seoul Semiconductor |
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6 / 15 page ![]() Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008 September 2008 www.ZLED.com www.ZLED.com 3.Outline Dimension ( Tolerance: ±0.1, Unit: mm ) 2.0 3.8 [Recommended Solder Pattern] 2 3.0 1 3 4 Resin 2.2 PCB 0.3 1.4 3 4 Marking 2.0 R0.3 1 2 0.85 1.35 0.5 [Top view] [Side view] [Bottom view] 0.47 0.42 0.4 0.4 Anode Common 3 2 41 [Inner Circuit Diagram] * MATERIALS Au Plating Copper Alloy Electrodes Epoxy Encapsulating Resin BT_Resin Package MATERIALS PARTS |
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