TC9491BCZM datasheet(2/3 Pages) TELCOM

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3-16

TELCOM SEMICONDUCTOR, INC.

ABSOLUTE MAXIMUM RATINGS*

Forward Current .................................................... +10mA

Reverse Current .................................................... +30mA

Storage Temperature Range ................ – 65

°C to +150°C

Operating Temperature Range

TO-92 Package ..................................... 0

°C to +70°C

COA Surface Mount Package ............... 0

°C to +70°C

Lead Temperature (Soldering, 10 sec)

TO-92 Package .............................................. +300

°C

COA Surface Mount Package ........................ +300

°C

Power Dissipation

Limited by Forward/Reverse Current

*Functional operation above the absolute maximum stress ratings is not

implied.

TC9491

OUTPUT

INPUT

36 k

Ω

RESPONSE TIME TEST CIRCUIT

ELECTRICAL CHARACTERISTICS: TA = +25°C, unless otherwise specified.

TC9491A

TC9491B

Symbol

Parameter

Test Conditions

Min

Typ

Max

Min

Typ

Max

Unit

V(BR)R

Reverse Breakdown Voltage

IR ≤ 20mA

1.200

1.22

1.250

1.200

1.220

1.250

TA = 0°C to +70°C

1.180

—

1.290

1.219

—

1.260

IRMIN

Minimum Operating Current

µA

TA = +25°C

—

8.0

—

8.0

TA = 0°C to +70°C—

—

∆V(BR)R

Reverse Breakdown Voltage

Change with Current

IRmin = IR = 1.0mA, TA = +25°C

—

1.0

—

1.0

TA = 0°C to +70°C

—

1.5

—

1.5

1.0mA = IR = 20mA, TA = +25°C—

—

TA = 0°C to +70°C—

—

Reverse Dynamic Impedance

IR = 100µA

—

0.6

—

0.6

—

Ω

∆V(BR)/∆T Average Temperature Coefficient

µA = IR = 20mA

—

100

ppm/

°C

Long Term Stability

IR = 100µA,

—

ppm/kHR

TA = +25°C ±0.1°C

LOW POWER, BANDGAP

VOLTAGE REFERENCES

TC9491A

TC9491B

TC9491BCZM Datasheet(PDF) 2 Page - TelCom Semiconductor, Inc

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