LTC4089-1 datasheet(21/24 Pages) LINER

21 / 24 page

LTC4089-1

40891f

APPLICATIO S I FOR ATIO

The power dissipation in the other power compo-

nents—catch diodes, MOSFETs, boost diodes and induc-

tors—causes additional copper heating and can further

increase the “ambient” temperature of the IC.

Board Layout Considerations

As discussed in the previous section, it is critical that

the exposed metal pad on the backside of the LTC4089-1

package be soldered to the PC board ground. Further-

more, proper operation and minimum EMI requires a

careful printed circuit board (PCB) layout. Note that large,

switched currents ﬂow in the power switch (between the

HVIN and SW pins), the catch diode and the HVIN input

capacitor. These components, along with the inductor and

output capacitor, should be placed on the same side of

the circuit board, and their connections should be made

on that layer. Place a local, unbroken ground plane below

these components. The loop formed by these components

should be as small as possible. Additionally, the SW and

BOOSTnodesshouldbekeptassmallaspossible.Figure8

showstherecommendedcomponentplacementwithtrace

and via locations.

High frequency currents, such as the high voltage input

current of the LTC4089-1, tend to ﬁnd their way along

the ground plane on a mirror path directly beneath the

incident path on the top of the board. If there are slits or

cuts in the ground plane due to other traces on that layer,

the current will be forced to go around the slits. If high

frequency currents are not allowed to ﬂow back through

their natural least-area path, excessive voltage will build

up and radiated emissions will occur. See Figure 9.

4089 F09

VIN and VHVIN Bypass Capacitor

Many types of capacitors can be used for input bypassing,

however,cautionmustbeexercisedwhenusingmultilayer

ceramic capacitors. Because of the self-resonant and high

Q characteristics of some types of ceramic capacitors,

high voltage transients can be generated under some

start-up conditions, such as from connecting the charger

input to a hot power source. For more information, refer

to Application Note 88.

Battery Charger Stability Considerations

Theconstant-voltagemodefeedbackloopisstablewithout

any compensation when a battery is connected with low

impedanceleads.Excessiveleadlength,however,mayadd

enough series inductance to require a bypass capacitor

of at least 1µF from BAT to GND. Furthermore, a 4.7µF

capacitor with a 0.2 to 1 series resistor to GND is

recommended at the BAT pin to keep ripple voltage low

when the battery is disconnected.

Figure 8. Suggested Board Layout

Figure 9. Ground Currents Follow Their Incident Path

at High Speed. Slices in the Ground Plane Cause High

Voltage and Increased Emissions.

C1 AND D1

GND PADS

SIDE-BY-SIDE

AND SEPERATED

WITH C3 GND PAD

U1 THERMAL PAD

SOLDERED TO PCB.

VIAS CONNECTED TO ALL

GND PLANES WITHOUT

THERMAL RELIEF

MINIMIZE D1, L1,

C3, U1, SW PIN LOOP

MINIMIZE TRACE LENGTH

4089-1 F08

LTC4089-1 Datasheet(PDF) 21 Page - Linear Technology

LTC4089-1 Datasheet(HTML) 21 Page - Linear Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Datasheet Download

Link URL