Altera Corporation

1

May 2008, version 3.0

Data Sheet

DS-CYTHRML-3.0

Cyclone Series Device

Thermal Resistance

Revision

History

The following table shows the revision history for this data sheet.

Tables 1 through 6 in this data sheet provide

thermal resistance) and

BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),

Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),

Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).

f

For additional packaging information, refer to the Altera Device Packaging

Data Sheet.

Date

Document Version

Changes Made

May 2008

3.0

Updated Tables 2, 4, and 5.

July 2007

2.2

Updated values for EP3C25 (E144) device in Table 2.

May 2007

2.1

Updated values for EP3C10 (E144) device in Table 2 and added

Revision History.

March 2007

2.0

Added Cyclone III information.

April 2006

1.0

Initial release.