THS4051, THS4052

70-MHz HIGH-SPEED AMPLIFIERS

SLOS238C– MAY 1999 – REVISED MAY 2000

27

POST OFFICE BOX 655303

MECHANICAL INFORMATION

DGN (S-PDSO-G8)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

0,69

0,41

0,25

Thermal Pad

(See Note D)

0,15 NOM

Gage Plane

4073271/A 01/98

4,98

0,25

5

3,05

4,78

2,95

8

4

3,05

2,95

1

0,38

0,15

0,05

1,07 MAX

Seating Plane

0,10

0,65

M

0,25

0

°–6°

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions include mold flash or protrusions.

D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically

and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MO-187

PowerPAD is a trademark of Texas Instruments.