THS4601

SLOS388B – OCTOBER 2001 – REVISED JUNE 2002

26

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MECHANICAL DATA

DDA (S–PDSO–G8)

Power PAD

t PLASTIC SMALL-OUTLINE

6,20

5,84

3,81

3,99

4202561/A 02/01

85

14

1,68 MAX

0,13

4,98

4,80

0

°–8°

0,41

0,89

0,25

0,20 NOM

Seating Plane

0,49

0,35

0,03

1,40

1,55

Thermal Pad

(See Note D)

M

0,10

0,10

1,27

Gage Plane

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

PowerPAD is a trademark of Texas Instruments.