TLV2361, TLV2361Y, TLV2362, TLV2362Y

HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS

SLOS195B – FEBRUARY 1997 – REVISED OCTOBER 1998

3

POST OFFICE BOX 655303

TLV2361Y chip information

This chip, when properly assembled, has characteristics similar to the TLV2361. Thermal compression or

ultrasonic bonding can be used on the doped-aluminum bonding pads. This chip can be mounted with

conductive epoxy or a gold-silicon preform.

Bonding-Pad Assignments

Chip Thickness: 15 Mils Typical

Bonding Pads: 4

× 4 Mils Minimum

TJ(max) = 150°C

Tolerances Are

±10%.

All Dimensions Are in Mils.

Pin (2) is Connected Internally to Backside of Chip.

OUT

IN+

IN–

VCC+

VCC–

39

39

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(4)

(5)

(3)

(2)

(1)

+

–

(1)

(3)

(4)

(2)

(5)