TLV226x, TLV226xA

Advanced LinCMOS

™ RAIL-TO-RAIL

OPERATIONAL AMPLIFIERS

SLOS186A – FEBRUARY 1997 – REVISED JULY 1999

25

POST OFFICE BOX 655303

TYPICAL CHARACTERISTICS

Figure 10

DISTRIBUTION OF TLV2264 INPUT OFFSET

VOLTAGE TEMPERATURE COEFFICIENT

10

5

30

0

20

15

25

35

–5

–4

–3

–2

–1

0

1

2

3

4

5

128 Amplifiers From

2 Wafer Lots

VDD

± = ±1.5 V

N Package

TA = 25°C to 125°C

αVIO – Temperature Coefficient

of Input Offset Voltage –

µV/°C

Figure 11

DISTRIBUTION OF TLV2264 INPUT OFFSET

VOLTAGE TEMPERATURE COEFFICIENT

10

5

30

0

20

15

25

35

–5

–4

–3

–2

–1

0

1

2

3

4

5

128 Amplifiers From

2 Wafer Lots

VDD

± = ±2.5 V

N Package

TA = 25°C to 125°C

αVIO – Temperature Coefficient

of Input Offset Voltage –

µV/°C

Figure 12

10

5

30

0

25

45

65

85

20

15

25

vs

FREE-AIR TEMPERATURE

35

105

125

IIB

IIO

VDD

± = ±2.5 V

VIC = 0

VO = 0

RS = 50 Ω

TA – Free-Air Temperature – °C

Figure 13

0

2

1

1.5

2

2.5

1

0.5

1.5

INPUT VOLTAGE

vs

SUPPLY VOLTAGE

2.5

3

3.5

4

– 0.5

–1

– 1.5

–2

– 2.5

RS = 50 Ω

TA = 25°C

| VIO | ≤ 5 mV

|VDD

±| – Supply Voltage – V

† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.