TLV821 SINGLE/TLV822 DUAL/TLV824 QUAD

OPERATIONAL AMPLIFIERS

SLOS296A – FEBRUARY 2000 – REVISED MAY 2000

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

TA

PACKAGE

PACKAGED DEVICES

TA

TYPE

SINGLE

DUAL

QUADRUPLE

5 pin SOT

TLV821IDCKR

—

—

5-pin SOT

TLV821IDBVR

—

—

–40

°C to 85°C

8-pin SOIC

—

TLV822ID

—

8-pin TSSOP

—

TLV822IPWR

—

14-pin SOIC

—

—

TLV824ID

14-pin TSSOP

—

—

TLV824IPWR

The D package is available taped and reeled. Add the suffix R to the device type (e.g., TLV824IDR).

The DCK, DBV, and PW packages are only available left-end taped and reeled.

5.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±5.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0 to 5.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Unlimited

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating virtual junction temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

97

°C/W

. . . . . . . . . . . . . . . . . . . . . .

D (14-pin) package

86

°C/W

. . . . . . . . . . . . . . . . . . . .

DBV package

347

°C/W

. . . . . . . . . . . . . . . . . . . . . . . .

DCK package

389

°C/W

. . . . . . . . . . . . . . . . . . . . . . . .

PW (8-pin) package

149

°C/W

. . . . . . . . . . . . . . . . . . .

PW (14-pin) package

113

°C/W

. . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package

260

°C

. . . . . . . . . . . . . .

–65 to 150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.

2. Differential voltages are at IN+ with respect to IN–.

3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable

ambient temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability.

5. The package thermal impedance is calculated in accordance with JESD 51.