TLV2474IPWPR datasheet(18/41 Pages) TI

18 / 41 page

TLV2470, TLV2471, TLV2472, TLV2473, TLV2474, TLV2475, TLV247xA

FAMILY OF 600−

µA/Ch 2.8−MHz RAIL−TO−RAIL INPUT/OUTPUT

HIGH−DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SLOS232C - JUNE 1999 - REVISED AUGUST 2003

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

general PowerPAD

 design considerations

The TLV247x is available in a thermally-enhanced PowerPAD family of packages. These packages are

constructed using a downset leadframe upon which the die is mounted [see Figure 46(a) and Figure 46(b)]. This

arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see

Figure 46(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance

can be achieved by providing a good thermal path away from the thermal pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of

surface mount with the, heretofore, awkward mechanical methods of heatsinking.

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

NOTE A: The thermal pad is electrically isolated from all terminals in the package.

Figure 46. Views of Thermally Enhanced DGN Package

Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the

recommended approach.

68 mils x 70 mils) with 5 vias

(Via diameter = 13 mils

78 mils x 94 mils) with 9 vias

(Via diameter = 13 mils)

Thermal Pad Area

Single or Dual

Quad

Figure 47. PowerPAD PCB Etch and Via Pattern

PowerPAD is a trademark of Texas Instruments Incorporated.

TLV2474IPWPR Datasheet(PDF) 18 Page - Texas Instruments