CX3SCSM1 datasheet(2/2 Pages) RSG

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RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de

TEM C

ERTIF

10123 - Rev B

SPECIFICATIONS

Specifications are typical at 25

OC unless otherwise noted.

Specifications are subject to change without notice.

Frequency Range

800 kHz - 1.35 MHz

Functional Mode

Extensional

Calibration Tolerance*

500 ppm (0.05%)

1000 ppm (0.1%)

10000 ppm (1.0%)

Load Capacitance

7 pF

Motional Resistance (R1)

5 k

Ω MAX

Motional Capacitance (C1) 1.2 fF

Quality Factor (Q)

150 k

Shunt Capacitance (C0)

1.0 pF

Drive Level

µW MAX.

Turning Point (T0)**

Temperature Coefficient (k) -0.035 ppm/

OC2

Note: Frequency f at temperature T is related to frequency f0

at turning point temperature T0 by:

Aging, first year

5 ppm MAX

Shock, survival

1000 g peak, 0.3 ms,1/2 sine

Vibration, survival

10 g RMS, 20-1,000 Hz random

Operating Temp. Range

-10

OC to +70OC (Commercial)

-40

OC to +85OC (Industrial)

-55

OC to +125OC (Military)

Storage Temp. Range

-55

OC to +125OC

Max Process Temperature

260

OC for 20 sec.

* Tighter tolerances available.

** Other values available.

f-f0

k(T-T0)

HOW TO ORDER CX3SM CRYSTALS

CX3

SM1

1.0M,

500

TERMINATIONS

Designation

Termination

SM1

Gold Plated

SM2

Solder Plated

SM3

Solder Dipped

PACKAGING OPTIONS

CX3SM

- Tray Pack

- Tape and Reel

(Reference tape and reel data sheet 10109)

TYPICAL APPLICATION

FOR A PIERCE OSCILLATOR

The low profile CX miniature surface mount crystal is ideal

for small, high density, battery operated portable products.

The CX crystal designed in a Pierce oscillator (single

inverter) circuit provides very low current consumption and

high stability. A conventional CMOS Pierce oscillator circuit

is shown below. The crystal is effectively inductive and in a

PI-network circuit with CD and CG provides the additional

phase shift necessary to sustain oscillation. The oscillation

frequency (f0) is 15 to 150 ppm above the crystal’s series

resonant frequency (fS).

Drive Level

RA is used to limit the crystal’s drive level by forming a

voltage divider between RA and CD. RA also stabilizes the

oscillator against changes in the amplifiers output

resistance (R0). RA should be increased for higher voltage

operation.

Load Capacitance

The CX crystal calibration tolerance is influenced by the

effective circuit capacitances, specified as the load

capacitance (CL). CL is approximately equal to:

NOTE: CD and CG include stray layout to ground and CS

is the stray shunt capacitance between the crystal

terminal. In practice, the effective value of CL will be less

than that calculated from CD, CG and CS values because

of the effect of the amplifier output resistance. CS should

be minimized.

The oscillation frequency (f0) is approximately equal to:

AMPLIFIER

BUFFER

CX3

XTAL

OSC

Freq (f )

CONVENTIONAL CMOS

PIERCE OSCILLATOR CIRCUIT

f0 = fS

[1+

]

2(C0 + CL)

(2)

Where f

= Series resonant frequency of the crystal

C1 = Motional Capacitance

C0 = Shunt Capacitance

CL =

CD x CG

CD + CG

(1)

“S” if special or

custom design.

Blank if Std.

Blank = Glass Lid

C = Ceramic Lid

SM1 = Gold Plated

SM2 = Solder Plated

SM3 = Solder Dipped

Frequency

K = kHz

M = MHz

Calibration

Tolerance

@ 25

(in ppm)

Operating Temp. Range:

C = -10

OC to +70OC

= -40

OC to +85OC

M = -55

OC to +125OC

S = Customer Specified

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