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AS4DDR32M72-75/XT Datasheet(PDF) 13 Page - Austin Semiconductor

Part # AS4DDR32M72-75/XT
Description  32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit
PDF  19 Pages
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Manufacturer  AUSTIN [Austin Semiconductor]
Direct Link  http://www.austinsemiconductor.com
Logo AUSTIN - Austin Semiconductor

AS4DDR32M72-75/XT Datasheet(HTML) 13 Page - Austin Semiconductor

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iiiiiPEM
PEM
PEM
PEM
PEM
2.4G
2.4G
2.4G
2.4G
2.4Gb SDRAM-DDR
b SDRAM-DDR
b SDRAM-DDR
b SDRAM-DDR
b SDRAM-DDR
AS4DDR32M72PBG
AS4DDR32M72PBG
Rev. 1.2 06/09
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
13
Austin Semiconductor, Inc.
ELECTRICAL
CHARACTERISTICS
AND
RECOMMENDED
AC
OPERATING
CHARACTERISTICS (NOTES 1-5, 14-17, 33)
Min
Max
Min
Max
tAC
-0.70
+0.70
-0.75
+0.75
ns
tCH
0.45
0.55
0.45
0.55
tCK
tCL
0.45
0.55
0.45
0.55
tCK
CL=2.5 (45, 52)
tCK (2.5)
6
13
7.5
13
ns
CL=2 (45, 52)
tCK (2)
7.5
13
8
13
ns
tDH
0.45
0.5
ns
tDS
0.45
0.5
ns
tDIPW
1.75
1.75
ns
tDQSCK
-0.6
+0.6
-0.75
+0.75
ns
tDQSH
0.35
0.35
tCK
tDQSL
0.35
0.35
tCK
tDQSQ
0.45
0.5
ns
tDQSS
0.75
1.25
0.75
1.25
tCK
tDSS
0.2
0.2
tCK
tDSH
0.2
0.2
tCK
tHP
tCH, tCL
tCH, tCL
ns
tHZ
+0.7
+0.75
ns
tLZ
-0.7
-0.75
ns
tIHF
0.75
0.9
ns
tISF
0.75
0.9
ns
tIHS
0.8
1.0
ns
tISS
0.8
1.0
ns
tMRD
12
15
ns
tQH
ns
tQHS
0.55
1
ns
tRAS
42
70,000
40
120,000
ns
tRAP
15
15
ns
tRC
60
60
ns
tRFC
72
75
ns
tRCD
15
15
ns
tRP
15
15
ns
tRPRE
0.9
1.1
0.9
1.1
tCK
tRPST
0.4
0.6
0.4
0.6
tCK
tRRD
12
15
ns
tWPRE
0.25
0.25
tCK
tWPRES
00
ns
tWPST
0.4
0.6
0.4
0.6
tCK
tWR
15
15
ns
tWTR
11
tCK
NA
ns
tREFC
70.3
70.3
µs
tREFC
35
35
µs
tREFI
7.8
7.8
µs
tREFI
3.9
3.9
µs
tVTD
00
ns
tXSNR
75
75
ns
tXSRD
200
200
tCK
tQH - tDQSQ
tHP-tQHS
tHP-tQHS
tQH - tDQSQ
Symbol
@CL=2.5 [CL=2]
-6, 333 [266] Mbps
Units
-75, 266 [250] Mbps
@CL=2.5 [CL=2]
Exit SELF REFRESH to non-READ command
Exit SELF REFRESH to READ command
Clock cycle time
Parameter
REFRESH to REFRESH command interval (Military temp only) (23)
Average periodic refresh interval (Commercial & Industrial temp only) (23)
Average periodic refresh interval (Military temp only) (23)
Terminating voltage delay to Vcc (53)
Write recovery time
Internal WRITE to READ command delay
REFRESH to REFRESH command interval (Commercial & Industrial temp
Active bank a to ACTIVE bank b command
DQS write preamble
DQS write preamble setup time (20,21)
DQS write postamble (19)
PRECHARGE command period
DQS read preamble (42)
DQS read postamble
Data valid output window (25)
ACTIVE to READ with Auto precharge command
ACTIVE to ACTIVE/AUTO REFRESH command period
AUTO REFRESH command period (50)
ACTIVE to READ or WRITE delay
LOAD MODE REGISTER command cycle time
DQ-DQS hold, DQS to first DQ to go non-valid, per access (25, 26)
Data hold skew factor
ACTIVE to PRECHARGE command (35)
Address and control input hold time (fast slew rate) (14)
Address and control input setup time (fast slew rate) (14)
Address and control input hold time (slow slew rate) (14)
Address and control input setup time (slow slew rate) (14)
DQS falling edge to CLK rising - hold time
Half clock period (34)
Data-out high-impedance window from CLK/CLK# (18, 42)
Data-out low-impedance window from CLK/CLK# (18, 43)
DQS input high pulse width
DQS-DQ skew, DQS to last valid, per group, per access (25,26)
Write command to first DQS latching transition
DQS falling edge to CLK rising - setup time
DQ and DM input setup time relative to DQS (26,31)
DQ and DM input pulse with (for each input) (31)
Access window of DQS from CLK/CLK#
DQS input high pulse width
Access window of DQs from CLK/CLK#
CLK high-level width (30)
CLK low-level width (30)
DQ and DM input hold time relative to DQS (26, 31)



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