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STM32F103xC Datasheet(PDF) 41 Page - STMicroelectronics

Part # STM32F103xC
Description  High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  123 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103xC Datasheet(HTML) 41 Page - STMicroelectronics

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STM32F103xC, STM32F103xD, STM32F103xE
Electrical characteristics
Doc ID 14611 Rev 7
41/123
5.2
Absolute maximum ratings
Stresses above the absolute maximum ratings listed in Table 7: Voltage characteristics,
Table 8: Current characteristics, and Table 9: Thermal characteristics may cause permanent
damage to the device. These are stress ratings only and functional operation of the device
at these conditions is not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Table 7.
Voltage characteristics
Symbol
Ratings
Min
Max
Unit
VDD–VSS
External main supply voltage (including VDDA
and VDD)
(1)
1.
All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
–0.3
4.0
V
VIN
Input voltage on five volt tolerant pin(2)
2.
IINJ(PIN) must never be exceeded (see Table 8: Current characteristics). This is implicitly insured if VIN
maximum is respected. If VIN maximum cannot be respected, the injection current must be limited
externally to the IINJ(PIN) value. A positive injection is induced by VIN > VINmax while a negative injection is
induced by VIN < VSS.
VSS  0.3
+5.5
Input voltage on any other pin(2)
VSS 0.3
VDD+0.3
|
V
DDx|
Variations between different VDD power pins
50
mV
|VSSX VSS| Variations between all the different ground pins
50
VESD(HBM)
Electrostatic discharge voltage (human body
model)
see Section 5.3.12:
Absolute maximum ratings
(electrical sensitivity)
Table 8.
Current characteristics
Symbol
Ratings
Max.
Unit
IVDD
Total current into VDD/VDDA power lines (source)
(1)
1.
All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
150
mA
IVSS
Total current out of VSS ground lines (sink)
(1)
150
IIO
Output current sunk by any I/O and control pin
25
Output current source by any I/Os and control pin
 25
IINJ(PIN)
(2)(3)
2.
IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS.
3.
Negative injection disturbs the analog performance of the device. See note in Section 5.3.18: 12-bit ADC
characteristics.
Injected current on NRST pin
± 5
Injected current on HSE OSC_IN and LSE OSC_IN pins
± 5
Injected current on any other pin(4)
4.
When several inputs are submitted to a current injection, the maximum
I
INJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with
I
INJ(PIN) maximum current injection on four I/O port pins of the device.
± 5
I
INJ(PIN)
(2)
Total injected current (sum of all I/O and control pins)(4)
± 25



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