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MCP6V01-E/MD Datasheet(PDF) 33 Page - Microchip Technology |
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MCP6V01-E/MD Datasheet(HTML) 33 Page - Microchip Technology |
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33 / 44 page ![]() © 2008 Microchip Technology Inc. DS22058C-page 33 MCP6V01/2/3 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 8-Lead SOIC (150 mil) Example : XXXXXXXX XXXXYYWW NNN MCP6VO1E SN 0750 256 3 e XXXXXX 8-Lead DFN (4x4) (MCP6V02) XXXXXX YYWW NNN Example 6V02 E/MD^^ 0750 256 3 e 8-Lead TDFN (2x3) (MCP6V01, MCP6V03) Example: XXX YWW NN AAA 838 25 Device Code MCP6V01 AAA MCP6V03 AAB Note: Applies to 8-Lead 2x3 TDFN |
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