© 2009 Microchip Technology Inc.

DS22150A-page 27

25XX160C/D

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

PART NO.

X

/XX

Package

Tape & Reel

Device

Device:

25AA160C

25AA160D

25LC160C

25LC160D

16 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM

16 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM

16 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM

16 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM

Tape & Reel:

Blank

=

T=

Standard packaging

Tape & Reel

Temperature

Range:

I=

E=

-40

°C to+85°C

-40

°C to+125°C

Package:

MS

=

P=

SN

=

ST

=

Plastic MSOP (Micro Small Outline), 8-lead

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (3.90 mm body), 8-lead

TSSOP, 8-lead

8-lead 2x3 mm TDFN

Examples:

a)

25AA160C-I/MS = 16 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., MSOP

package

b)

25AA160CT-I/SN = 16 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

c)

25LC160DT-I/SN = 16 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

d)

25LC160DT-I/ST = 16 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

TSSOP package

–

Note

1:

“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.

X

Temp Range