TDA8922C datasheet(21/40 Pages) NXP

21 / 40 page

TDA8922C_1

Product data sheet

Rev. 01 — 7 September 2009

21 of 40

NXP Semiconductors

TDA8922C

× 75 W class-D power ampliﬁer

The most effective way to avoid pumping effects is to connect the TDA8922C in a mono

full-bridge conﬁguration. In the case of stereo single-ended applications, it is advised to

connect the inputs in anti-phase (see Section 8.4 on page 11). The power supply can also

be adapted; for example, by increasing the values of the supply line decoupling

capacitors.

13.7 Application schematic

Notes on the application schematic:

• Connect a solid ground plane around the switching ampliﬁer to avoid emissions

• Place 100 nF capacitors as close as possible to the TDA8922C power supply pins

• Connect the heatsink to the ground plane or to VSSPn using a 100 nF capacitor

• Use a thermally conductive, electrically non-conductive, Sil-Pad between the

TDA8922C heat spreader and the external heatsink

• The heat spreader of the TDA8922C is internally connected to VSSD

• Use differential inputs for the most effective system level audio performance with

unbalanced signal sources. In case of hum due to ﬂoating inputs, connect the

shielding or source ground to the ampliﬁer ground.

TDA8922C Datasheet(PDF) 21 Page - NXP Semiconductors