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FPD3000 Datasheet(PDF) 1 Page - RF Micro Devices

Part # FPD3000
Description  2W POWER pHEMT
PDF  4 Pages
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Manufacturer  RFMD [RF Micro Devices]
Direct Link  http://www.rfmd.com
Logo RFMD - RF Micro Devices

FPD3000 Datasheet(HTML) 1 Page - RF Micro Devices

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Features
1 of 4
Optimum Technology
Matching® Applied
GaAs HBT
InGaP HBT
GaAs MESFET
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Product Description
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
InP HBT
LDMOS
RF MEMS
FPD3000
2W POWER pHEMT
The FPD3000 is an AlGaAs/InGaAs pseudomorphic High Electron Mobility Transis-
tor (pHEMT), featuring a 0.25
μmx3000μm Schottky barrier gate, defined by high -
resolution stepper-based photolithography. The recessed gate structure minimizes
parasitics to optimize performance. The epitaxial structure and processing have
been optimized for reliable high-power applications. The FPD3000 is also available
in the low-cost plastic SOT89 package.
32.5dBm Linear Output
Power at 12GHz
6.5dB Power Gain at 12GHz
8dB Max Stable Gain at
12GHz
42dBm OIP3
30% Power-Added Efficiency
Applications
Narrowband and Broadband
High-Performance Amplifiers
SATCOM Uplink Transmitters
PCS/Cellular Low-Voltage
High-Efficiency Output Ampli-
fiers
Medium-Haul Digital Radio
Transmitters
Rev A1 DS090612
Package Style: Bare Die
FPD30002W
Power pHEMT
Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
Electrical Specifications
P1dB Gain Compression
31.5
32.5
dBm
VDS=8V, IDS=50% IDSS
Maximum Stable Gain (S21/S12)
7.0
8.0
dB
VDS=8V, IDS=50% IDSS
Power Gain at P1dB (G1dB)6.0
6.5
dB
VDS=8V, IDS=50% IDSS
Power-Added Efficiency (PAE)
30
%
VDS=8V, IDS=50% IDSS, POUT=P1dB
OIP3
42
dBm
VDS=8V, IDS=50% IDSS
44
dBm
Matched for optimal power, tuned for best IP3
Saturated Drain-Source Current (IDSS)
750
930
1100
mA
VDS=1.3V, VGS=0V
Maximum Drain-Source Current
(IMAX)
1.5
A
VDS=1.3V, VGS≈+1V
Transconductance (GM)
800
ms
VDS=1.3V, VGS=0 V
Gate-Source Leakage Current (IGSO)10
μAVGS=-5V
Pinch-Off Voltage (VP)
|1.0|
V
VDS=1.3V, IDS=3mA
Gate-Source Breakdown Voltage
(VBDGS)
|12.0|
|14.0|
V
IGS=3mA
Gate-Drain Breakdown Voltage
(VBDGD)
|14.5|
|16.0|
V
IGD=3mA
Thermal Resistivity (
θJC)
20
°C/W
VDS>6V
Note: TAMBIENT=22°C, RF specifications measured at f=12GHz using CW signal.


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