| Electronic Components Datasheet Search |
|
CPC7581MATR Datasheet(PDF) 15 Page - Clare, Inc. |
|
|
|||||||||||||||||||||||||||||
CPC7581MATR Datasheet(HTML) 15 Page - Clare, Inc. |
|
15 / 17 page ![]() CPC7581 R05 www.clare.com 15 3.2 Printed-Circuit Board Layout 3.2.1 SOIC 3.2.2 DFN As the metallic pad on the bottom of the DFN package is connected to the substrate of the die, Clare recommends that no printed circuit board traces or vias be placed under this area. 2.00 (0.079) 1.27 (0.050) mm (inches) DIMENSIONS 9.40 (0.370) 0.60 (0.024) DIMENSIONS mm (inches) 5.80 (0.228) 0.35 (0.014) 1.05 (0.041) 0.80 (0.031) |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |