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L9UG9753 Datasheet(PDF) 5 Page - LIGITEK electronics co., ltd. |
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L9UG9753 Datasheet(HTML) 5 Page - LIGITEK electronics co., ltd. |
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5 / 7 page  LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 245 ±5℃ within 5 sec Soldering heat Max. 260 ℃ Soldering heat 120 ~ 150 ℃ 120 ~ 180 sec Preheat Soldering Iron: Basic spec is ≦5 sec when 260℃. If temperature is higher, time should be shorter(+10 ℃ → -1sec). Power dissipation of iron should be smaller than 15W,and temperature should be controllable. Surface temperature of the device should be under 230 ℃. 220 Temp. ( ℃) Reflow Temp/Time 120 150 Preheat Rising +5 ℃/sec Cooling -5 ℃/sec 60 ~ 120 sec 5sec Time PART NO. L9UG9753 |
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