SN65MLVD048 datasheet(3/18 Pages) TI

3 / 18 page

SN65MLVD048

www.ti.com

SLLS903 – DECEMBER 2009

Table 1. DEVICE FUNCTION TABLE

INPUTS(1)

RECEIVER TYPE

OUTPUT(1)

VID = VA – VB

PDN

FSEN

VID > 35 mV

Type 1

–35 mV

≤ VID ≤ 35 mV

Type 1

VID < – 35 mV

Type 1

VID > 135 mV

Type 2

65 mV

≤ VID ≤ 135 mV

Type 2

VID < 65 mV

Type 2

Open Circuit

Type 1

Open Circuit

Type 2

OPEN

(1)

H=high level, L=low level, Z=high impedance, X=Don’t care, ?=indeterminate

ORDERING INFORMATION(1)

PART NUMBER

FUNCTION

PART MARKING

PACKAGE / CARRIER

MLVD048

48-Pin QFN / Tape and Reel

SN65MLVD048RGZR

M-LVDS Type 1 and 2 Receiver

SN65MLVD048RGZT

MLVD048

48-Pin QFN / Small Tape and Reel

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

PACKAGE DISSIPATION RATINGS

(1)

TA ≤ 25°C

DERATING FACTOR(2)

TA = 85°C

PACKAGE

PCB TYPE

POWER RATING

ABOVE TA = 25°C

POWER RATING

Low-K

1298 mW

12.98 mW/°C

519 mW

48-Pin QFN (RGZ)

High-K

3448 mW

34.48 mW/°C

1379 mW

(1)

The thermal dissipations are in the consideration of soldering down the powerPAD without via on each type of boards.

(2)

This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.

THERMAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

RθJB

Junction-to-board thermal resistance

°C/W

RθJC

Junction-to-case thermal resistance

°C/W

RθJP

Junction-to-pad thermal resistance

1.37

°C/W

Device power dissipation

RE at 0 V, CL = 15 pF, VID = 400 mV, 125 MHz

339

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