LA55141 datasheet(5/5 Pages) LIGITEK

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1.Ta=65

℃±5℃

2.RH=90 %~95%

3.t=240hrs

±2hrs

High Temperature

High Humidity Test

The purpose of this test is the resistance

of the device under tropical for hous.

MIL-STD-202:103B

JIS C 7021: B-11

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

1.T.Sol=230

℃±5℃

2.Dwell time=5

±1sec

Solderability Test

This test intended to see soldering well

performed or not.

1.T.Sol=260

℃±5℃

2.Dwell time= 10

±1sec.

1.Ta=105

℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

Solder Resistance

Test

Thermal Shock Test

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

Reliability Test:

MIL-STD-883:1008

JIS C 7021: B-10

JIS C 7021: B-12

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

1.Ta=105

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

1.Ta=-40

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Low Temperature

Storage Test

High Temperature

Storage Test

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

The purpose of this is the resistance of

the device which is laid under ondition

of high temperature for hours.

Test Condition

Test Item

Operating Life Test

Description

Reference

Standard

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LA55141

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