Analog Integrated Circuit Device Data

4

Freescale Semiconductor

34845

ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

Table 2. Absolute Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Maximum Pin Voltages

SWA, SWB, VOUT

CH1, CH2, CH3, CH4, CH5, CH6 (Off state)

CH1, CH2, CH3, CH4, CH5, CH6 (On state)

FAIL, OVP

COMP, ISET

PWM, WAKE

EN, VIN

-0.3 to 65

-0.3 to 45

-0.3 to 20

-0.3 to 7.0

-0.3 to 2.7

-0.3 to 5.5

-0.3 to 24

V

Maximum LED Current per Channel

33

mA

ESD Voltage(1)

Human Body Model (HBM)

Machine Model (MM)

±2000

±200

V

THERMAL RATINGS

Operating Ambient Temperature Range

-40 to 85

°C

Maximum Junction Temperature

150

°C

Storage Temperature Range

-40 to 150

°C

Peak Package Reflow Temperature During Reflow(2), (3)

Note 3

°C

Thermal Resistance Junction to Ambient(4)

36

°C/W

Thermal Resistance Junction to Case(5)

3.1

°C/W

Power Dissipation(4)

TA = 25°C

TA = 85°C

3.4

1.8

W

Notes

1.

2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

4.

Per JEDEC51-8 Standard for Multilayer PCB

5.

Theoretical thermal resistance is from the die junction to the exposed pad.