MPXV6115VC6U datasheet(6/8 Pages) FREESCALE

Part #	MPXV6115VC6U

Description	High Temperature Accuracy Integrated Silicon Pressure Sensor

PDF	8 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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6 / 8 page

MPXV6115V

Sensors

Freescale Semiconductor

Pressure

SURFACE MOUNTING INFORMATION

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

Figure 5. SOP Footprint (Case 482A)

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP

2.54

0.300

7.62

inch

MPXV6115VC6U Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc