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ST7669 Datasheet(PDF) 2 Page - Sitronix Technology Co., Ltd. |
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ST7669 Datasheet(HTML) 2 Page - Sitronix Technology Co., Ltd. |
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2 / 216 page ![]() ST7669 Ver 1.3a 2/216 3/2/2009 3 Pad Arrangement (COG) Chip Size : 14030 um x 970 um Bump Pitch : PAD 1 ~ 30, 31 ~ 35 pitch=27um(min, com/seg) PAD 200 ~ 204, 205 ~ 737 pitch=27um(min, com/seg) PAD 36 ~ 199 pitch=80um (I/O) PAD 87,88 pitch= 79.72um(I/O) Bump Size : PAD 1 ~ 35 , PAD 200 ~ 737 Bump width=14um(min, com/seg) Bump space=13um(min, com/seg) Bump length=128um(min, com/seg) Bump area=1800um^2(com/seg) PAD 36 ~86,89~199(except 87,88) Bump width=65um(I/O) Bump space=15um(I/O) Bump length=63um(I/O) Bump area=4095um^2 PAD 87,88 Bump width=65um(I/O) Bump space=14.72um(I/O) Bump length=63um(I/O) Bump area=4095um^2 Bump Height : 15 um Chip Thickness : 400 um Aligment mark The center of alignment mark: see bellow Table |
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