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SF2012201YL Datasheet(PDF) 6 Page - ABC Taiwan Electronics Corp

Part # SF2012201YL
Description  SMD LINE FILTER
PDF  7 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  ABC [ABC Taiwan Electronics Corp]
Direct Link  http://www.atec-group.com
Logo ABC - ABC Taiwan Electronics Corp

SF2012201YL Datasheet(HTML) 6 Page - ABC Taiwan Electronics Corp

  SF2012201YL Datasheet HTML 1Page - ABC Taiwan Electronics Corp SF2012201YL Datasheet HTML 2Page - ABC Taiwan Electronics Corp SF2012201YL Datasheet HTML 3Page - ABC Taiwan Electronics Corp SF2012201YL Datasheet HTML 4Page - ABC Taiwan Electronics Corp SF2012201YL Datasheet HTML 5Page - ABC Taiwan Electronics Corp SF2012201YL Datasheet HTML 6Page - ABC Taiwan Electronics Corp SF2012201YL Datasheet HTML 7Page - ABC Taiwan Electronics Corp  
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AR-001A
SPECIFICATION FOR APPROVAL
PROD.
NAME
Ⅸ﹒RELIABILITY TEST：
REF : 20090324-B
ABC'S ITEM NO.
ABC'S DWG NO.
PAGE: 6
SMD LINE FILTER
SF2012□□□□L□-□□□
1-1.Environmental Performance
No
Item
Specification
1-1-1 Temperature Cycle
Appearance: No Damage
One cycle:
Impedance: within±20% of
Step
Temperature (℃)
Time (min)
initial value
1
-25±3
30
2
25±23
3
85±3
30
4
25±23
Total: 5 cycles
Measured After Exposure in The Room Condition For 1hrs
1-1-2 Humidity Resistance
Temperature: 40±2℃
Relative Humidity: 90 ~ 95%
Time: 100hrs
Measured After Exposure In The Room Condition For 1hrs
1-1-3 High Temperature Resistance
Temperature: 85±3℃
Time: 50Hrs
Measured After Exposure In The Room Condition For 1Hrs
1-1-4 Low Temperature Resistance
Temperature: -25±3℃
Time: 50Hrs
Measured After Exposure In The Room Condition For 1Hrs
1-1-5 High Temperature Load Life
There should be no evidence
Temperature: 85±3℃
of short or open circle
Load: Allowed DC Current
Time: 500Hrs
1-1-6 Humidity Load Life
Temperature: 40±2℃
Relative Humidity: 90~95%
Load: Allowed DC Current
Time: 500Hrs
1-2.Mechanical Performance
No
Item
Specification
1-2-1 Resistance To Soldering Heat
Appearance: No Damage
1. The Device Should Be Reflow soldered on PCB
(peak 260℃±5℃ For 10 Seconds)
2. Solder Composition: Sn/Ag3.0/Cu0.5
3. Test Time: 6 minutes
1-2-2 Solder ability
The Electrodes Shall Be
1. Pre-Heating: 150℃,1min.
At Least 90% Covered
2. Solder Composition: Sn/Ag3.0/Cu0.5
with New Solder Coating
3. Solder Temperature: 245±5℃.
4. Immersion Time: 4±1 sec.
1-2-3 Commponent Adhesion
2 Lbs
The device should be reflow soldered (230±5
℃ For
(Push Test)
10 seconds) to a tinned copper substrate. A force guauge
should be applied to the side of the component.
The device must withstand a minimum force of 2 pounds
without a failure of the termination attached to component
Test Method
Test Method



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